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> PRODUCTS > PHOTOVOLTAIC > PV EQUIPMENT > Non-destructive Laser Splitter (FLC-7200)

Non-destructive Laser Splitter (FLC-7200)

A new generation of non-cooling non-destructive cutting technology. Technology The use of self-developed laser spot shaping and laser waveform customization technology, so that the silicon material in a very short time to form a predetermined change in the temperature field, the use of laser temperature field and space temperature difference to form a regular thermal stress gradient, to induce the silicon wafer along the laser prefabricated slot to form cracks and guide crack growth, in the case of no atomizing liquid cooling to separate the battery.

equipment features

1. The machining section is neat, no obvious cracks burrs and damage

2. Less non-destructive cutting section lines, high bending strength of the battery,

3. The processing temperature is 160°, the low temperature does not damage the silicon substrate of the battery, and the HJT battery is cut Half-efficiency loss <0.2%. Compatible with high-efficiency splicing methods such as narrow spacing negative spacing TOPCON battery half-cutting efficiency loss <0.15%,

production process

Main process: feeding → slotting → splicing → testing → cutting

product parameters

serial number	project	specifications
1	Equipment size	3900mm1700mm1800mm
2	Capacity	Double stroke ≥7200p/h (full film)
3	Reject ratio	≤0.05%
4	Laser	Laser wavelength of 1064 nm
5	Cutting way	Slotted + split cutting method
6	Cutting straightness	±0.075mm
7	Slot length	≤1.5mm