Non-destructive Laser Splitter (FLC-7200)
A new generation of non-cooling non-destructive cutting technology. Technology The use of self-developed laser spot shaping and laser waveform customization technology, so that the silicon material in a very short time to form a predetermined change in the temperature field, the use of laser temperature field and space temperature difference to form a regular thermal stress gradient, to induce the silicon wafer along the laser prefabricated slot to form cracks and guide crack growth, in the case of no atomizing liquid cooling to separate the battery.
equipment features
production process
product parameters
| serial number | project | specifications |
|---|---|---|
| 1 | Equipment size | 3900mm*1700mm*1800mm |
| 2 | Capacity | Double stroke ≥7200p/h (full film) |
| 3 | Reject ratio | ≤0.05% |
| 4 | Laser | Laser wavelength of 1064 nm |
| 5 | Cutting way | Slotted + split cutting method |
| 6 | Cutting straightness | ±0.075mm |
| 7 | Slot length | ≤1.5mm |
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