Double station laser cutting processing equipment
Dual-station laser cutting processing equipment, mainly used in electronics, new energy industry parts cutting and other process processing.
equipment features
product parameters
| serial number | project | specifications |
|---|---|---|
| 1 | Composite material UV(nanosecond/picosecond) 355nm | Carbon fiber cutting |
| 2 | Sapphire Subpicosecond /1064nm Picosecond /1064nm | Sapphire glass cutting, drilling |
| 3 | glass UV/355nm Picosecond /1064nm | Tempered glass Cutting and micro drill bits |
| 4 | metal N-IR/1064nm | Stainless steel/Copper, aluminum Cutting and micro-drilling |
| 5 | Ceramics/Graphite IR/1064nm | Al2O3/AlN/CrO Cutting, drilling, marking |
| 6 | Flexible PCB/PCB UV/355nm Green/532nm | Copper clad PI/FR4/ polyimide Cutting and micro drill bits |
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